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Production of Sn Base Composite Solder Reinforced by Nanoparticles Via Melt-spinning Technique

Mohammadyari, Saeid | 2017

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 49420 (07)
  4. University: Sharif University of Technology
  5. Department: Materials Science and Engineering
  6. Advisor(s): Tavakkoli, Rouhollah
  7. Abstract:
  8. Lead-containing solder alloys in particular Sn-37Pb is the most common alloy used in electronics industry, this alloy has the good mechanical properties and excellent wetting properties and low prices. Recently, increasing environmental and health concerns over the toxicity of lead combined with strict legislation to ban the use of lead-based solders have provided an inevitable driving force for the development of lead-free solder alloys. A group of these lead-free solders are nanocomposite solders that because of having the reinforcement nano particles exhibit lots of unique properties, such as good mechanical and thermal properties. The aim of this research produce a new tin base nanocomposite lead free solder with suitable properties by melt-spinning technique. For this purpose four Sn base nanocomposite solders of compositions Sn-3.8Ag-0.7Cu, Sn-3.8Ag-0.7Cu-0.25Al, Sn-3.8Ag-0.7Cu-0.5Al and Sn-3.8Ag-0.7Cu-1Al have been produced by the chill-block melt-spinning technique. The microstructure of the rapidly solidified ribbons were measured by X-ray diffraction (XRD) technique. The results showed that the structure of the nanocomposite solders prepared by melt-spinning technique is composed of nanoparticles Cu6Sn5, Ag3Sn IMCs and Sn (β). Also melting point, microhardness, electrical resistivity, and contact angle of the Sn base nanocomposite solders were measured. The results showed that microhardness and wettability properties of nanocomposite solders are more than Sn-3.8Ag-0.7Cu solder
  9. Keywords:
  10. Nanocomposite ; Melt Spinning ; Intermetallic Compounds ; Lead Free Solders ; Nanocomposite Solder

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