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Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints

Nourani, A ; Sharif University of Technology

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  1. Type of Document: Article
  2. DOI: 10.1016/j.engfracmech.2017.09.027
  3. Abstract:
  4. Fracture experiments with ball grid array (BGA) specimens having different adherend rigidities were performed under bending loads at intermediate strain rates (0.2–1 s−1) and a high strain rate of 30 s−1. A cohesive zone model (CZM) was established and the predictive capability of the model was assessed for the specimens with different rigidities. The predicted fracture loads were within 12% of the measured forces when the CZM parameters were obtained using specimens with a similar degree of constraint. This suggests that in many practical cases, the effect of adherend stiffness can be neglected in predicting the strength of BGA solder joints. © 2017 Elsevier Ltd
  5. Keywords:
  6. BGA ; CZM ; Solder joint ; Ball grid arrays ; Fracture ; Intermetallics ; Rigidity ; Soldered joints ; Stiffness ; BGA solder joints ; Cohesive zone model ; Fracture experiments ; High strain rates ; Intermediate strain rate ; Predictive capabilities ; Solder joints ; Strain-rate-dependent ; Strain rate
  7. Source: Engineering Fracture Mechanics ; Volume 186 , 2017 , Pages 119-133 ; 00137944 (ISSN)
  8. URL: https://www.sciencedirect.com/science/article/pii/S001379441730574X