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Solvent-free preparation of copper ferrite microspheres composed of nanorods using a new coordination compound as precursor

Hashemi, M ; Sharif University of Technology | 2017

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  1. Type of Document: Article
  2. DOI: 10.1007/s10854-017-6971-x
  3. Publisher: Springer New York LLC , 2017
  4. Abstract:
  5. This work presents a simple solvent-free route based on solid-state thermal decomposition approach to synthesize magnetic copper ferrite (CuFe2O4) microspheres and copper ferrite/metal oxide composites. For this purpose, [Cu(en)3]3[Fe(ox)3]2 complex (where en = ethylenediamine and ox = oxalate) was introduced as a new single-source precursor. Ferromagnetic property of the nanostructures was determined by alternating gradient force magnetometer. The effect of different ligands and temperatures on the morphology of the products was investigated. Solid-state thermal decomposition of the precursor at different temperatures in the range of 400–800 °C led to the fabrication of magnetic copper ferrites with various particle sizes. X-ray powder diffraction patterns and images of scanning electron microscopy showed formation of CuFe2O4/Fe2O3 microspheres with very smooth surfaces and CuFe2O4/CuO microspheres coated with nanorods by thermal decomposition of the precursor at 400 and 700 °C, respectively. The results confirmed that copper ferrite and CuFe2O4/CuO nanocomposites were suitable materials with appropriate performance in catalyst and photo-catalytic applications. © 2017, Springer Science+Business Media New York
  6. Keywords:
  7. Copper ; Copper alloys ; Copper compounds ; Magnetic materials ; Microspheres ; Nanorods ; Scanning electron microscopy ; Thermolysis ; X ray powder diffraction ; Alternating gradient force magnetometers ; Coordination compounds ; Decomposition approach ; Ethylene diamine ; Ferromagnetic properties ; Oxide composites ; Photo-catalytic ; Single-source precursor ; Ferrite
  8. Source: Journal of Materials Science: Materials in Electronics ; Volume 28, Issue 16 , 2017 , Pages 11682-11688 ; 09574522 (ISSN)
  9. URL: https://link.springer.com/article/10.1007%2Fs10854-017-6971-x