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Predicting delamination in multilayer composite circuit boards with bonded microelectronic components

Akbari, S ; Sharif University of Technology | 2018

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  1. Type of Document: Article
  2. DOI: 10.1016/j.engfracmech.2017.11.026
  3. Publisher: Elsevier Ltd , 2018
  4. Abstract:
  5. The present work developed a mixed-mode cohesive zone model (CZM) with a mode I failure criterion to predict the delamination bending loads of multilayer, composite printed circuit boards (PCBs) assembled with soldered ball grid array (BGA) components that were reinforced with an underfill epoxy adhesive. Two different delamination modes were observed in these microelectronic assemblies: delamination at the interface between the solder mask and the first conducting layer of the PCB, and PCB subsurface delamination at the interface between the epoxy and glass fibers of one of the prepreg layers. The cohesive parameters for each of the two crack paths were obtained from fracture tests of bending test specimens consisting of PCB substrates bonded with the underfill adhesive. The model provided relatively accurate predictions of the crack paths and the bending strength of the actual underfilled BGA-PCB assemblies for a range of adhesive fillet sizes, PCB stiffnesses, and strain rates. © 2017 Elsevier Ltd
  6. Keywords:
  7. Cohesive zone modeling ; Composite circuit boards ; Delamination ; Finite element analysis ; Microelectronic components ; Ball grid arrays ; Bending strength ; Bending tests ; Cracks ; Delamination ; Failure (mechanical) ; Finite element method ; Forecasting ; Fracture testing ; Microelectronics ; Multilayers ; Printed circuit manufacture ; Strain rate ; Timing circuits ; Accurate prediction ; Circuit boards ; Cohesive zone model ; Delamination bending ; Microelectronic assembly ; Multilayer composite ; Printed circuit board (PCBs) ; Printed circuit boards
  8. Source: Engineering Fracture Mechanics ; Volume 187 , 2018 , Pages 225-240 ; 00137944 (ISSN)
  9. URL: https://www.sciencedirect.com/science/article/pii/S0013794417307221