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Design and Implementation of Local Interconnect Network (LIN)Transceiver in High Voltage BCD 0.18 um

Maghbouli, Mahsa | 2018

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 51521 (05)
  4. University: Sharif University of Technology
  5. Department: Electrical Engineering
  6. Advisor(s): Medi, Ali; Faez, Ramin
  7. Abstract:
  8. In this study, a Local Interconnect Network (LIN) transceiver was designed and implemented. This chip contains transmitter, receiver, low power receiver, digital control unit, oscillator, voltage regulator, high voltage switch, temperature sensor and battery voltage detector. The main focus on this study was on designing transmitter,receiver, low power receiver and temperature sensor. Through designing of this chip, in addition to functional and physical layer specification that mentioned in ISO 17987, electromagnetic compatibility specifications have been considered significantly.The designed chip with slope control and wave shaping of BUS signal has excellent radiated emission performance. Furthermore, implementation of EMI filter in receiver path causes robustness against radio frequency (RF) disturbances within an automotive environment. This chip is functional in 6 to 26 volt supply voltage range and does not damage up to 40 volt battery voltage.This system has several different modes. In normal mode data with max. baud rate of 20 kbit/s is transported between micro controller and BUS. Designed chip is capable to increase data rate up to 100 kbit/s in fast buad rate mode. Moreover, this chip can go to sleep or low power mode that has low quiescent current. This chip can wake-up through two ways of local or remote wake-up
  9. Keywords:
  10. High Voltage CMOS Technology ; Analog Front End (AFE)Cheap ; Local Interconnect Network (LIN) ; Bipolar-CMOS-DMOS Technology ; Bus Conductor ; Electromagnetic Compatibilty (EMC) ; Electromagnetic Emission ; Radio Frequency Distorbance

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