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Microstructure and mechanical properties of pure Cu interlayer TLP joints of 304 stainless steel to dual phase steel

Mohammadi, M ; Sharif University of Technology | 2020

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  1. Type of Document: Article
  2. DOI: 10.1016/j.jmatprotec.2019.116276
  3. Publisher: Elsevier Ltd , 2020
  4. Abstract:
  5. Bonding was carried out at 1150 °C for holding times of 60 and 90 min followed by water quenching. At the bonding time of 60 min, Cu remained at the bond region resulting in an unstable liquid/solid interface with a sinusoidal microstructure. Isothermal solidification completed at the holding time of 90 min. Unidirectional solidification was observed from the stainless steel side toward the low carbon manganese steel and abnormal grain growth of stainless steel was seen at the bond region due to temperature gradient which originated from different electrical properties of the parent alloys. Joints made at the bonding time of 90 min were homogenized at 730 °C for 75 min and quenched in water to produce dual phase ferrite-martensite microstructure in the low C-Mn steel. Shear strength of the homogenized joint was greater than that of the low C-Mn steel and was about 80% of that of the 304 stainless steel under the same treatment condition. © 2019 Elsevier B.V
  6. Keywords:
  7. Dual-phase steel ; Shear strength ; Temperature gradient ; Austenitic stainless steel ; Copper ; Dual phase steel ; Grain growth ; Low carbon steel ; Manganese alloys ; Manganese removal (water treatment) ; Mechanical properties ; Microstructure ; Solidification ; Thermal gradients ; Abnormal grain growth ; Isothermal solidification ; Liquid/solid interface ; Low carbon-manganese steels ; Microstructure and mechanical properties ; Transient liquid phase ; Treatment conditions ; Unidirectional solidification ; Manganese steel
  8. Source: Journal of Materials Processing Technology ; Volume 275 , January , 2020
  9. URL: https://www.sciencedirect.com/science/article/abs/pii/S0924013619302481