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Si/Si, Si/SiO2 and SiO2/SiO2 fusion wafer bonding

Motieifar, A ; Sharif University of Technology | 2003

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  1. Type of Document: Article
  2. Publisher: Sharif University of Technology , 2003
  3. Abstract:
  4. The wafer bonding process has many applications in the fabrication of microelectronic, optoelectronic, power and micromachined devices. In this article, fusion bonding of silicon wafers and study of their interface are reported for the first time in Iran. Also, the bonding of two silicon wafers, with one (or both) of the wafers having a thermally grown silicon dioxide layer, has been performed and tested. © Sharif University of Technology, October 2003
  5. Keywords:
  6. Composite ; Silicon ; Fabrication
  7. Source: Scientia Iranica ; Volume 10, Issue 4 , 2003 , Pages 477-480 ; 10263098 (ISSN)
  8. URL: http://scientiairanica.sharif.edu/article_2613.html