Loading...

Impact of Temperature on Efficiency of CNT and Copper Interconnects

| 2012

602 Viewed
  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 43310 (05)
  4. University: Sharif University of Technology
  5. Department: Electrical Engineering
  6. Advisor(s): Sarvari, Reza
  7. Abstract:
  8. While digital IC technology scales down, the impact of size effects in copper interconnects become more important because wire dimensions reach the same order of electron mean free path yielding increased resistivity of metal due to surface and grain boundary scatterings. Hence, because of their longer MFP, Carbon nanotubes are proposed as potential candidates for replacing copper interconnects. Furthermore, wires, especially power and ground lines, are becoming more and more vulnerable to electromigration because of rapid grows in current densities which increases the temperature of IC and interconnects as well. Sub-ambient cooling has long been suggested for improving the performance of integrated circuits because it improves the performances of both transistors and interconnects as GSI chips become increasingly power limited. Sub-ambient cooling increases the electron mean free path of electrons allowing us to scale down IC technology more effectively. Emergence of cryogenic technologies such as sub-ambient cooling and, probable high temperature of interconnects, urge us to study the impact of temperature on efficiency of copper and CNT interconnects. Herein, we study temperature behavior of CNT and Copper interconnects in temperature ranges of 50~600 K and find out that in a certain temperature range (80~400 K), CNT interconnects outperform copper interconnects while, copper interconnects are superior to their counterparts out of this range
  9. Keywords:
  10. Copper ; Carbon Nanotubes ; Themperature ; Inter Connects

 Digital Object List

 Bookmark