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- Type of Document: M.Sc. Thesis
- Language: Farsi
- Document No: 43329 (19)
- University: Sharif University of Technology
- Department: Computer Engineering
- Advisor(s): Hessabi, Shahin
- Abstract:
- Combination of 3D IC technology and network on chip (NoC) is an effective solution to increase system scalability, and also alleviate the interconnect problem in large scale integrated circuits. However, due to the increased power density in 3D NoC systems and the destructive impact of high temperatures on chip reliability, applying thermal management solutions becomes crucial in such circuits. Since hardware thermal control techniques, such as DVFS, can cause significant degradation on chip performance, in this thesis we propose a runtime distributed migration algorithm based on game theory to balance the heat dissipation among processing elements (PEs) in 3D NoCs. The objective of this algorithm is to minimize the 3D NoC system’s peak temperature, as well as the overhead imposed on chip performance during migration. Due to the high thermal correlation between adjacent PEs in the same stack in 3D NoCs, we model this multi-objective problem as a cooperative game. Simulation results for different groups of benchmarks show up to 28% peak temperature reduction after applying the proposed algorithm in order to mitigate the temperature condition in 3D NoC architectures. This comes at the price of slight migration overhead on system performance, which is also reported in terms of power-delay product (PDP)
- Keywords:
- Three Dimentional Network on Chip (NOC) ; Task Migration ; Game Theory
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