Simulation of Surface Chemical Reactions in Bosch Process for a Polymer Film and Investigation of Etching Quality

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Montazeri Shahtoori, Abdolsamad | 2017

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Type of Document: M.Sc. Thesis
Language: Farsi
Document No: 49686 (08)
University: Sharif University of Technology
Department: Mechanical Engineering
Advisor(s): Saeedi, Mohammad Saeed
Abstract:
Deep reactive ion etching is one of the most used techniques for manufacturing micro-structures. The most popular silicon DRIE technique is Bosch process. Ability to manufacture high aspect ratio features made Bosch process the main technique for developing micro-electromechanical devices. Dry etching is a combination of physical and chemical processes. The chemical processes play a very important role due to their speed of material removing and also due to their high selectivity. Also chemical processes are responsible for development of passive resist layer on the surface. On the other hand, if not controlled properly it can reduce anisotropy, resulting in a low quality etch. In this project, Bosch process is simulated and the effects of chemical reactions on etching rate and quality of surface is studied
Keywords:
Plasma ; Bosch-Process Etching Method ; Surface Reactions ; Chemical Reactions ; Particles in Cell Technique ; Surface Chemical Reactions

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