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Effect of bonding temperature on microstructure development during TLP bonding of a nickel base superalloy

Pouranvari, M ; Sharif University of Technology | 2009

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  1. Type of Document: Article
  2. DOI: 10.1016/j.jallcom.2008.01.101
  3. Publisher: 2009
  4. Abstract:
  5. The effect of bonding temperature on microstructure of a transient liquid phase (TLP)-bonded GTD-111 nickel base superalloy, using a Ni-Si-B interlayer, was investigated. At low bonding temperatures microstructure of the joint centerline is controlled by B diffusion. However, at high bonding temperature effect of base metal alloying elements on the joint microstructure development was more pronounced. Effects of bonding temperature on the formation of secondary precipitates in diffusion-affected zone and isothermal solidification time were also analyzed. It was found that above a critical temperature, formation of borides in diffusion-affected zone is suppressed and the time required for isothermal solidification completion is increased. © 2008 Elsevier B.V. All rights reserved
  6. Keywords:
  7. High-temperature alloys ; TLP bonding ; Alloying elements ; Borides ; Crystallization ; Diffusion ; Metallic compounds ; Microcrystalline silicon ; Microstructure ; Nickel ; Nickel alloys ; Solidification ; B diffusions ; Base metals ; Bonding temperatures ; Critical temperatures ; In diffusions ; Inter-layers ; Isothermal solidifications ; Joint microstructures ; Microstructure developments ; Nickel-base superalloys ; Secondary precipitates ; Transient liquid phase ; Superalloys
  8. Source: Journal of Alloys and Compounds ; Volume 469, Issue 1-2 , 2009 , Pages 270-275 ; 09258388 (ISSN)
  9. URL: https://www.sciencedirect.com/science/article/pii/S0925838808001540