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Heat Conduction Modeling in Optical Network-on-Chips and Presenting Thermally-Resilient ONoC Architecture

Tinati, Melika | 2017

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 50132 (19)
  4. University: Sharif University of Technology
  5. Department: Computer Engineering
  6. Advisor(s): Hesabi, Shahin; Kouhi, Somayyeh
  7. Abstract:
  8. Integrated silicon photonic networks have attracted a lot of attention in the recent decade due to their potential for low-power and high-bandwidth communications. However, despite high bandwidth and low-loss data communication capability, optical NoCs are susceptible to on-chip temperature variations. In these promising networks, packets’ erroneous routing due to thermally-induced resonant wavelength shift of microring resonators are common temporary faults unless heat control mechanism is adopted. In other words, thermal drifts may paralyze wavelength-based operation of these networks. On the other hand, employing a heat control mechanism in an ONoC necessitates developing thermal fault models for various optical resources in the optical layer. In this regard, precise addressing of thermally induced faults in optical networks-on-chip (ONoCs), as well as revealing pertinent methods to tackle this challenge will be a break-even point through implementation of this technology. Herein, we develop a precise model for heat conduction in multi-layer ONoC, based on Fourier’s law, and through this model, we evaluate system-level faults induced by thermal drifts. Addressing the impact of power consumed by various electrical cores on the generated heat, we evaluate heat conduction throughout the optical layer. In this dissertation, thermal variation is investigated through analyzing on-chip power distribution, which is addressed by power profile extracted from both synthetic power distributions and power distributions of benchmark applications of SPEC 2006. Then, we evaluate thermally-induced data mis-routing, in terms of network fault rate, as the ratio of number of the misrouted packets to total number of transmitted packets through the optical network. The aforementioned network-level exploration is adopted in two types of networks, and under various design criteria. Based on the aforementioned assessments, later in this dissertation, we propose a thermal-resilient network architecture that significantly mitigates routing faults in ONoC. Utilizing a corrective unit in this architecture, 50% of the thermally induced switching faults are recovered with the cost of only 1.8% area overhead. In addition, up to 42% performance improvement is achieved through this architecture in comparison to the basic architecture. Finally, we explore scalability of The-RONoC based on formal SNR analysis, as well as power consumption and the probability of optical transmission speed-up
  9. Keywords:
  10. Heat Conduction ; Power Distribution ; Thermal Variation ; On-Chip Optical Network ; System-level Fault ; Thermally-Resilient Architecture

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