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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 39885 (05)
  4. University: Sharif University of Technology
  5. Department: Electrical Engineering
  6. Advisor(s): Haj Sadeghi, Khosro; Hesabi, Shahin
  7. Abstract:
  8. The fast development of semiconductor industry has moved the design methodology to SoC (System on Chip) design. Due to the increasing number of processing elements, In SoC, buses become the bottleneck of the system and lead to non-efficient designs. NoC (Network onChip) is an efficient solution that eliminates bus bottleneck and it had been introduced as a suitable substructure for interconnecting processing elements. The NoCs were originally built based on Interconnection Networks.They have been proposed as an efficient, scalable, modular and reliable solution to provide on chip communication in any large SoC design. The trend of market to mobile digital systems and battery-powered devices, throughput, area and the energy consumption are the most three important parameters which are considered. Message is the communication unit between processing elements. Before injecting in the network, the messages are divided into smaller parts which are called packets. In Section I of this project, the communication model of NoC is presented and then the operation of packetization unit in this structure is discussed. Moreover, the effects of dividing messages into smaller packets on power consumption and throughput of the network are analyzed. In Section II, by changing the allocation method of physical channels, we present an efficient approach to improve throughput in high traffic regions. Finally, in Section III at first the adaptive message packetization algorithm, which is based on network traffic, is presented and then the implementation of this algorithm on top of our proposed structure is evaluated. The results have shown that the proposed approach can improve up to 24% and 26% of energy consumption and throughput respectively.
  9. Keywords:
  10. Network-on-Chip (NOC) ; Packaging ; Adaptation ; Energy Consumption ; Throughput

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