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The critical voltage of a GPL-reinforced composite microdisk covered with piezoelectric layer

Shamsaddini Lori, E ; Sharif University of Technology | 2021

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  1. Type of Document: Article
  2. DOI: 10.1007/s00366-020-01004-z
  3. Publisher: Springer Science and Business Media Deutschland GmbH , 2021
  4. Abstract:
  5. In this research, electrically characteristics of a graphene nanoplatelet (GPL)-reinforced composite (GPLRC) microdisk are explored using generalized differential quadrature method. Also, the current microstructure is coupled with a piezoelectric actuator (PIAC). The extended form of Halpin–Tsai micromechanics is used to acquire the elasticity of the structure, whereas the variation of thermal expansion, Poisson’s ratio, and density through the thickness direction is determined by the rule of mixtures. Hamilton’s principle is implemented to establish governing equations and associated boundary conditions of the GPLRC microdisk joint with PIAC. The compatibility conditions are satisfied by taking perfect bonding between the core and PIAC into consideration. Maxwell’s equation is employed to capture the piezoelectricity effects. The numerical results revealed the important role of ratios of length scale and nonlocal to thickness, outer-to-inner ratio of radius (Ro/ Ri), ratio of piezoelectric to core thickness (hp/h), and GPL weight fraction (gGPL) on the critical voltage of the system. Another important consequence is that by increasing Ro/ Ri, the critical voltage of the smart structure increases more intensely in comparison with the gGPL. © 2020, Springer-Verlag London Ltd., part of Springer Nature
  6. Keywords:
  7. Crystallography ; Differentiation (calculus) ; Maxwell equations ; Piezoelectric actuators ; Reinforcement ; Scales (weighing instruments) ; Thermal expansion ; Compatibility conditions ; Generalized differential quadrature methods ; Governing equations ; Numerical results ; Piezoelectric layers ; Piezoelectricity effect ; Reinforced composites ; Thickness direction ; Piezoelectricity
  8. Source: Engineering with Computers ; Volume 37, Issue 4 , 2021 , Pages 3489-3508 ; 01770667 (ISSN)
  9. URL: https://link.springer.com/article/10.1007/s00366-020-01004-z