Transient Liquid Phase Bonding of AA6061/SiC

Please enable javascript in your browser.

Asgari, Mohammad | 2010

658 Viewed

Type of Document: M.Sc. Thesis
Language: Farsi
Document No: 41063 (07)
University: Sharif University Of Technology
Department: Materials Science and Engineering
Advisor(s): Ekrami, Ali Akbar; Sayyed Reyhani, Morteza
Abstract:
Composites are made to obtain several mechanical and physical properties selectively. But joining and manufacturing of complex shapes restricts their usages. Transient liquid phase (TLP) bonding is a novel method for joining of these materials without any defects that occur in other welding methods, such as melting or solid state methods. In this research, temperture gradiant TLP bonding of AA6061/SiC/15p using gallium as interlayer was performed. To obtain the optimum conditions, joining was performed at 260, 310, 360 and 410 ˚C, and pressure of 5 and 10 Mpa with holding time of 5 and 10 minutes, the joined samples then solutionized at 530˚C for 70 minutes. Optical and scanning electron microscopes were used to determine the optimum conditions. The hardness and shear tests were carried out to check the accuracy of these conditions. The results showed that increasing the bonding temperture, pressure and holding time, joint microstructure became homogeneous with respect to the base metal microstructure
Keywords:
Homogenization ; Plastic Deformation ; Composite ; Al6061/SiCp composite ; Transient Liquid Phase (TLP)

No TOC