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Interfacial microstructure and properties of SiC/SiC joint brazed with Ag-Cu-Ti alloys

Nemati, A ; Sharif University of Technology

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  1. Type of Document: Article
  2. Abstract:
  3. SiC Ceramic was joined to itself using active brazing alloys, like Ti in shape of sheet filler of Ag-cu and Ti-6AI-4V. This operation occurred in an inert gas furnace. Interfacial microstructure was studied with scanning electron microscopy and X-Ray diffraction. Variation of Electrical Specific Resistance measured by 4 pin astute multimeter and strength of these joints was measured by fracture shear loading. This joint happened at 900°C and upper temperature with 90 minutes and upper time. Electrical specific resistance goes up with the joint in low temperature and time but this variation is very little. The microstructure showed excellent bonding at the interfaces. The data showed also that the joining of the SiC decreases with increasing temperature and time
  4. Keywords:
  5. Electrical specific resistance ; SEM ; Active brazing alloys ; Increasing temperatures ; Interfacial microstructure ; Low temperatures ; Shear loadings ; Specific resistances ; Strength ; XRD ; Ceramic materials ; Exhibitions ; Scanning electron microscopy ; Silicon carbide ; Silver ; Silver alloys ; X ray diffraction ; Loading
  6. Source: 11th International Conference and Exhibition of the European Ceramic Society 2009, 21 June 2009 through 25 June 2009 ; Volume 1 , 2009 , Pages 212-214 ; 9781617823848 (ISBN)
  7. URL: http://docplayer.net/43714709-11th-international-conference-and-exhibition-of-the-european-ceramic-society-2009.html