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Main and interaction effects of manufacturing variables on microstructure and fracture of solder-copper connections

Mohammadiamiri, M ; Sharif University of Technology | 2022

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  1. Type of Document: Article
  2. DOI: 10.1016/j.engfailanal.2022.106449
  3. Publisher: Elsevier Ltd , 2022
  4. Abstract:
  5. Finding the optimized set of manufacturing parameters to produce strong solder-copper connections requires investigating the main and interaction effects of processing variables on the joint strength and microstructure. In this study, solder joint specimens were prepared at different levels of cooling rate, time above liquidus (TAL), and soldering temperature. Mode I fracture experiments were designed and performed at a strain rate of 0.5 s−1. The fracture load remained constant from the cooling rate of 0.1 to 1.4 °C/s and then decreased by almost 34% with further increase in the cooling rate to 34 °C/s. Increasing TAL from 60 to 120 s reduced the fracture load by almost 27%, while it was almost unchanged from TAL of 120 to 240 s. The influence of soldering temperature on fracture load was negligible. Microstructural examination showed the cooling rate and TAL both affected intermetallic compound (IMC) thickness and this caused the interaction between them. © 2022 Elsevier Ltd
  6. Keywords:
  7. Cooling rate ; Fracture ; Intermetallic compound ; Microstructure ; Solder joint ; Cooling ; Copper ; Intermetallics ; Soldering ; Soldering alloys ; Strain rate ; Cooling rates ; Fracture load ; Interaction effect ; Intermetallics compounds ; Liquidus ; Main effect ; Manufacturing parameters ; Processing variables ; Solder joints ; Soldering temperature
  8. Source: Engineering Failure Analysis ; Volume 139 , 2022 ; 13506307 (ISSN)
  9. URL: https://www.sciencedirect.com/science/article/abs/pii/S135063072200423X