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- Type of Document: M.Sc. Thesis
- Language: Farsi
- Document No: 41199 (19)
- University: Sharif University of Technology
- Department: Computer Engineering
- Advisor(s): Ejlali, Alireza
- Abstract:
- Many embedded processors are used in harsh environments and their behavior should be investigated against the incidence of common faults. Fault Injection is a prevalent method to do this investigation. Simulation-based fault injection is one of the most prominent forms of fault injection. A fault model is required to do simulation-based fault injection. Simulated faults should have the most similarity to the real faults. Temperature variation and in the extreme case thermal shock is one of the probable faults in harsh environment. In this thesis, we want to propose fault models for thermal shock in various abstraction levels, evaluate and compare these fault models and present methods to use these faults models in simulation-based fault injection. Effect of temperature and thermal shock on the processor depends on many parameters such as extent of temperature variation, maximum temperature and duration of thermal shock. Thermal shock induced faults could be permanent or transient. In different situations, a thermal shock can be modeled as path delay fault model, transition delay fault model and stuck-at-1 fault model. In data transmission, thermal shock may lead to bit flip or transmission failure. When temperature rises above 300 degree of Celsius, Data in static RAM may change; but FLASH memory is robust against temperature variation
- Keywords:
- Temperature Variation ; Thermal Shock ; Fault Tolerance ; Fault Injection ; Embedded System ; Fault Modeling
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