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Reliability Improvement of Three-Dimensional Network-on-Chips by Thermal Management

Safari, Maedeh | 2017

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  1. Type of Document: M.Sc. Thesis
  2. Language: Farsi
  3. Document No: 50141 (19)
  4. University: Sharif University of Technology
  5. Department: Computer Engineering
  6. Advisor(s): Miremadi, Ghasem
  7. Abstract:
  8. Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher network bandwidth. 3D NoCs reduce length of communication link and transmition delay by die stacking. However, the length of heat conduction path and power density per unit area increase as more dies are stacked vertically. High temperature results in longer propagation delay and increases the leakage power. If heat production in the chip is not managed, low cooling rate for these layers is a threat for the chip performance and reliability. To solve the thermal problems, thermal management schemes were proposed in the literature, including proactive and reactive techniques. Proactive techniques try to keep network temperature under a certain thermal limit, while reactive techniques control network temperature after thermal limit exceeding with minimum performance impact. Although previous schemes can somehow balance the thermal distribution and reduce the peak temperature, they still suffer from traffic and temperature imbalance, and also from performance, computation, and area overheads. This thesis proposed an efficient proactive thermal management technique, so called Less Entrance to The Hot Region (LETHOR) routing algorithm, for 3D NoCs. LETHOR routing scheme proactively calculates a novel thermal-aware index that represents hotness of each tile, and decides routing path based on it. According to the experimental results, the LETHOR routing scheme reduces the variance of temperature and traffic by 11% and 34%, respectively. It also improves performance of the chip by 39% and increases the reliability by 40% compared to the baseline
  9. Keywords:
  10. Reliability ; Thermal Management ; Three Dimentional Network on Chip (NOC) ; Routing Algorithm ; Thermal Problem

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