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An efficient hybrid-switched network-on-chip for chip multiprocessors

Lotfi Kamran, P ; Sharif University of Technology

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  1. Type of Document: Article
  2. DOI: 10.1109/TC.2015.2449846
  3. Publisher: IEEE Computer Society
  4. Abstract:
  5. Chip multiprocessors (CMPs) require a low-latency interconnect fabric network-on-chip (NoC) to minimize processor stall time on instruction and data accesses that are serviced by the last-level cache (LLC). While packet-switched mesh interconnects sacrifice performance of many-core processors due to NoC-induced delays, existing circuit-switched interconnects do not offer lower network delays as they cannot hide the time it takes to set up a circuit. To address this problem, this work introduces CIMA - a hybrid circuit-switched and packet-switched mesh-based interconnection network that affords low LLC access delays at a small area cost. CIMA uses virtual cut-through (VCT) switching for short request packets, and benefits from circuit switching for longer, delay sensitive response packets. While a request is being served by the LLC, CIMA attempts to set up a circuit for the corresponding response packet. By the time the request packet is served and the response gets ready, a circuit has already been prepared, and as a result, the response packet experiences short delay in the network. A detailed evaluation targeting a 64-core CMP running scale-out workloads reveals that CIMA improves system performance by 21 percent over the state-of-the-art hybrid circuit-packet-switched network
  6. Keywords:
  7. Adaptive systems ; Delay circuits ; Integrated circuit interconnects ; Mesh generation ; Multiprocessing systems ; Reconfigurable hardware ; Servers ; Switching circuits ; VLSI circuits ; Chip multi-processors (CMPs) ; Chip Multiprocessor ; Circuit switching ; Interconnect fabrics ; Lastlevel caches (LLC) ; Low latency ; Many-core processors ; Network-on-chip(NoC)
  8. Source: IEEE Transactions on Computers ; Volume 65, Issue 5 , 2016 , Pages 1656-1662 ; 00189340 (ISSN)
  9. URL: http://ieeexplore.ieee.org/document/7134730