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Alumina-copper eutectic bond strength: contribution of preoxidation, cuprous oxides particles and pores

Ghasemi, H ; Sharif University of Technology | 2009

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  1. Type of Document: Article
  2. Publisher: 2009
  3. Abstract:
  4. The influences of cupric oxide layer thickness, cuprous oxide particles and pores on the mechanical properties and micro structure of an alumina-copper eutectic bond have been investigated. The furnace, atmosphere in the. first stage was argon gas with 2 × 10-6 atm oxygen partial pressure. In the second stage, the. furnace atmosphere was the. same as the first stage except that the cooling interval was between 900-100l°C and the hydrogen gas was injected into the. furnace, atmosphere. Finally, in the last stage, a vacuum furnace with 5 × 10-8 atra pressure was chosen for the bonding procedure. The peel strength of first stage specimens shows that a, cupric oxide layer with 320 ± 25 ran thickness generates maximum peel strength (l3.1 ± 0.3 kg/cm) in the joint interface. In the second stage, by using hydrogen gas, a joint interface free from any cuprous oxide particles was formed. In this case, the joint strength has increased to 17.1 ± 0.2 kg/cm. Finally, the bonding process in the. vacuum furnace indicates that the. furnace gas does not have a considerable effect on joint interface pores. Furthermore, the bonding process in the vacuum furnace reduces the peel strength of the joint due to the formation of more pores. A thorough study of pore formation is presented. © Sharif University of Technology, June 2009
  5. Keywords:
  6. Alumina-copper ; Bonding ; Argon gas ; Bond strength ; Bonding procedure ; Bonding process ; Cupric oxide ; Cuprous oxide ; Furnace atmosphere ; Hydrogen gas ; Joint interfaces ; Joint strength ; Last stage ; Oxygen partial pressure ; Peel strength ; Pore formation ; Pre-oxidation ; Alumina ; Argon ; Copper ; Copper oxides ; Eutectics ; Furnaces ; Mechanical properties ; Oxygen ; Phase interfaces ; Solar control films ; Vacuum ; Vacuum furnaces ; Aluminum oxide ; Chemical bonding ; Cooling ; Copper compound ; Hydrogen ; Mechanical property ; Microstructure ; Oxidation ; Oxide ; Partial pressure ; Porosity ; Strength ; Atra
  7. Source: Scientia Iranica ; Volume 16, Issue 3 B , 2009 , Pages 263-268 ; 10263098 (ISSN)
  8. URL: http://scientiairanica.sharif.edu/article_3214.html